Hardware Prototype to Connected App MVP — IoT, Firmware & Mobile Companion
3D-printed enclosure, BLE/WiFi, companion app, and cloud backend — how hardware founders ship a connected product MVP without a 12-month hardware program.
Table of Contents
Hardware founders face two bills: physical prototype and software companion. Most agencies only do software — we do the app, cloud, and firmware integration while you iterate industrial design and 3D-printed enclosures with your mechanical partner. This guide maps the split and realistic budgets.
Phase 1: Prove the Job (No Custom PCB Yet)
Use off-the-shelf dev boards (ESP32, Raspberry Pi Pico W, nRF52) + 3D-printed enclosure to validate the user workflow. Companion app connects via BLE or WiFi. Cloud: Supabase or Firebase for device registration and telemetry.
- 3D print enclosure: $50–$500 per iteration (Shapeways, local lab)
- Dev board + sensors: $30–$200
- Companion app MVP: $4,500–$9,000 (React Native + BLE)
- Skip custom ASIC/PCB until pre-orders or pilot contracts
Software Stack for Connected Hardware
React Native + Expo for companion app (iOS + Android). BLE via react-native-ble-plx. Device provisioning flow OTA. Backend: device table, firmware version, telemetry ingest, alerts. Admin dashboard for support team — Retool for v1.
What We Build vs What You Source
We build: mobile app, cloud backend, device pairing, OTA update hooks, analytics. You source: industrial design, PCB/firmware (or we integrate your firmware team's BLE GATT spec), manufacturing quotes. Honest boundary prevents scope disasters.
Regulatory & Certification (Plan Early)
Consumer electronics may need FCC/CE, battery safety, UL depending on category. Software-only MVP can launch in TestFlight/beta while hardware cert runs parallel — don't block app learning on FCC timeline.
Book a Hardware + App Scope Call
Bring: device spec, BLE/protocol docs if any, target BOM, and user flow. Fixed-price quotes from /booking — typical connected app MVP $4,500–$12,000 depending on BLE complexity and admin needs.
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